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-y--------. _._ 3 prepared by: date: ii -i ,.-- : a ;:,+;spec.no. -_ ti~~~t34-. jj&,~ -2 ; 97 s-a 1 ?i&j& .: ,,_ :-: fi -.-: pala approved by: date: electromc components group representative dmsion: / / sharp corporation specification opto-electronic devices division device specification for light emitting diode model no. ltled9oa 1. these specification sheets include materials protected under the copyright of sharp corporation (?sharp?). please do not reproduce or cause anyone to reproduce them without sharp?s consent. 2. when using this produ& please observe the absolute maximm ratings and the instructions for use outlined in these specification sheets, as well as the precautions mentioned below. sharp assumes no responsibility for any damage resuking from use of the product which does not comply with the absolute maximum ratings and the instructions included in these specification sheets, and the precautions mentioned below. (precautions) (1) this products is designed for use in the following application areas; r * oa equipment * audio visual equipment * home appliance l * telecommunication equipment (terminal) * measuring equipment * tooling machines * computers 1 if the use of the product in the above application areas is for equipment listed in paragraphs (2) or (3). please be sure to observe the precautions given in those respective paragraphs. (2) appropriate measures, such as w-safe design and redundant design considering the safety design of the overall system and equipment, should be taken to ensure reliability and safety when this product is used for equipment which demands high reliability and safety in fimction and precision, such as ; 1 r * transportation control and safety equipment (aircra& train, automobile etc.) * tra& signals * gas leakage sensor breakers * rescue and security equipment * other safety equipment 1 (3) please do not use this product for equipment which require extremely high reliability and safety in flnction and precision, such as ; r * space equipment * telecommunication equipment (for trunk lines) l * nuclear power control equipment l medical equipment i (4) please contact and consult with a sharp sales representative if there are any questions regarding interpretation of the above three paragraphs. 3. please contact and consult ,tith a sharp sales representative for any questions about this product. date: ac. / j / f7yy customer?s approval presented by. 4 &,i al . m.katoh, date: department general imanager of engineering dept.,111 opto-electronic devices division by: electronic components group sharp corporxtion
-, ,-. 1. . \ ,.: ,:?..; ltledsoa srxcifmtion 1. application this specification applies to the light emitting diode device model no. ltledsoa. [gapcienow-green)tg~/g~~ed)chip led device] 2. outline dimensions and terminal connections . . . . . . . . . . . ..-.........refertothe attached sheet page 2. 3. ratings and characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . refer to the attached sheet page 3 -6. 3-1. absolute maximum ratings 3-2. electra-optical characteristics 3-3. derating curve 3-4. yellow-green characteristics diagram 3-5. red characteristics diagram 4. reliability . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . refer to the attached sheet page 7. 4- 1. test items and test conditions 4-2. failure judgement criteria 5. lncoeg inspection . . . . . . . . . . . . . . . . . . . . ..*....................... refer to the attached sheet page 8. 5- 1. inspection method 5-2. des-cription of inspection and criteria 6. taping specikation . . . . . . . . . . . . . . . . . . . . . . ..*....................* refer to the attached sheet page 9- 11. 6-1. taping 6-2. packing specification 6-3. label 6-4. luminous intensity rank 7. soldering.. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ..*................ >refer to the attached sheet page 12. 7-1. reflow soldering * precautions foruse............................................... refer to the attached sheet page 13. s- 1. precautions matters for designing circuit 8-2, cleaning method 9. enhamenp.. . . . . . . . . *......................................... refer to thy attached sheet page 13. 9- 1. ozonosphere destructive chemicals. 9-2. bromic non-burning materials
2. outline dimensions and terminal c~~ecfio~ torminrl connoctlon 4 material finish drawing no. pwb: glass-epoxy resin: epoxy au plated 51112009
3. ratings aad characteristics (notel) duty ratio=i/1o,pulse width=o.ims (note2) &lamal soldering max& , (note3) each dissipation value of diode(yellow-green,red) is their own ratings ar generatings independently and the dissipation at the time when both diodes simultaneously generating should be within the half. red unit min. 1 i-yip. imax. - i 2.0 i 2.8 i v (note 3)measure.d by sharp eg&g model550(radiometer/photometersyste (tolerance : t 15%)
i ---.- -.__ dg-992004 d&3/99 * --._____ 3-3. d&g curve(yellow-green and red) fotward current denting curve peakforward curentdemtingcurve -25 0 25 50 7585100 125 0 25 50 75g5100 125 ambient temperature ta(?c) peak forward current vs. duty ratio (ta=25?c) duryrao . ambient temperature tfl)
-- -.-____ -.-_-_ _ _ d6- 992004 deem99 ?y--. -. r .ltledsoa . %- *- *> - ? ---- -- . 34. yellow-green chamcteristi~~ diagram(typ) (note 1) 0. 1 fomard current vs.fomard volee (ta=25"c) 1 1.2 1.4 1.6 1.8 2 2.2 2.4 forward voltage vf(v) i / iii/iii/ i 0. 1 1 10 100 forward current if(ma) relative luminous intensity vs. ambient tap- m=2omw 1000 g 2 z 2 2 100 b .- e 3 : .- 9 d 10 -60 -40 -20 0 20 40 60 80 100 120 ambient temprat~~~~ ta(?c) (note 1) above characteristic data are typical data and not a ,guaran tteed data.
dg-992004 d&/99 3-5. red chamctetistics diagam(typ) (note 1) 100 0. 1 forward current vnforward voltage 1 1.2 1.4 1.6 1.8 2 2.2 2.4 forward voltage vf(v) l relative luminous intensity vs. ambient temperature af=2oma~ 1000 c b z b y 5 100 a .b e 3 0 .z p 2 10 -60 -40 -20 0 20 40 60 80 100 120 ambient tmpraxure ta(?ci 0. 1 1 10 100 forward cummte=(ma) (note 1) above characteristic data are typical data and not a gmantteed dam
r 4. reliability the reliability of products shall be satisfied with items listed below. 4-l. test items and test conditions test items test conditions temperature cycling -25?c(3omin)-+loo?c(3omin),3otimes high temp. andhigh humidity storage ta=+60?c, 9o%rh, hooh e figh mpe&ure storage ta= 1 oo?c,t+ooh .ow temperature storage ta=25?c,t=sooh operating test ta=25?c,1,=30ma,r500h , mechanical shock 15 ooom/s?, osms, 3times / kx$y,*z direction variable titquency 2oom/s*, 100-2 ooo-loohz/sweepfor 4min. viily3tioil ,4timeayz direction soldering heat refer to the attached sheq page 1 l/12 ltimes cotidence level: 90% samples (il) ltpd defective (c) (%) n=32, c=o 10 n-22, c=o 10 n=22, c=o 10 n=?, c=o 10 n=22, go 10 n=ll, c=o 20 n=ll, c=o 20 n=ll, c=o 20 i 4-2. failure ju&ement criteria * 1 parameter symbol failure judgement criteria *2 forward voltage vf v, > u.s.l. x 1.2 reverse current ir ia > u.s.l. x 2.0 luminous intensity iv iv > the first stage value x 2.0 or the tit stage value x 0.5 > iv * 1: measuring condition is in accordance with specification. *2: u.s.l. is shown by upper specification limit.
5. incoming inspection .- 5- 1. inspection method a single sampling plan, normal inspection level s-4 based on is0 2859-l shah be adopted j-l. u~b,ipu?l.l ?i uqj?.*la?y liyy va-.-- fio. inspection items criteria defect a@ 1 electra-optical not radiation . . charactenstlcs 2 radiation color not correct major 3 taping product inserted in reverse direction defect 0.1% 4 label model number is not printed,or misprinted 5 solderbility 1 plating abnormality observed over 50% or greater percentage * 1 6 electra-optical characteristics not conforming to the specification 7 outline dimensions not conforming to the specification 8 dust : @ 0.8nun or more thread dust : 2.5mm or more in length and 0.25mm or i? more in width air bubbles : 4 0.8mm or more scratch : 2.5n.u.n or more in length and 025mm or more in width however&e product is qualified as a good unit if the -scrach does not touch the auwire.when seen from the front. resin batr : effect to the specification minor defect 0.4% resin flash:over the unspecified tolerance resin ond plated crack :0.3mm or more 9 solderbility 2 could solder 50% or greater and less than 90% out of judgement area * 1 the judgement area plated area of the product bottom
_. __ _ dg- 992004 de&/99 : i-- i :?-- modelno. - p&g< : .a ltledsoa - 5 &i? ?:-.a _ 2? .& & -------ad 6.taping specificarion 6-l.taping 6-1-l.shape and dime&on of tape(lyf?.) 6-l-2.shape and dimension of reel(typ.)
dg-992004 deem99 mbdel no. page z ltledsoa ? -iq8443 j 3 4 - .i --- ?. 6-l-3 .taping specification (1) lead tape: . pull ,,,i--> __ end 000000 0000000000 begirming q iciu~ q mnn 170 empty -i- stuffed a- empty i-leading ? 10 pitch or ?more 40-50 pitch (2) cover tape strength against peeling:p=o.l-o8n( 0 =lo?or less) cover tape c ? - ?yape speed : smm/s <- forward carrier tape (3) tape strength against bending: the radius of bending circle should be 3omm or more. ifit is less than 3omm, the cover may peel. (4) jointing of tape: there should not be joint of cover tape or carrier tape. (5) quantity per reel: average 3,ooopcs. per reel (6) mass per products: average 0.02g 1 product (7)mass per packing: average 150g i packing (8) others: @ there should not be missing above continuous three products. @ products should be easily taken out @ products should not be attached to the cover tape at peeling. 6-2. packing specification 6-2- 1. dampproof package in other to avoid the absorption of humidity in transport and storage, the device s are packed in aluminum sleeve. lab.31 6-2-2.strage conditions temperature : 5 to 30c humidity : less than 6o%rh 6-2-3.trement after opening (1) please make a soldering within 15 days after opening under following condition; temperature : 5 to 30c humidity : less than 6o%rh (2) in case the devices are not used for a long tune after opening ,the storage in dry box is recommendable. or it is better to repack the devices with a desiccative by the sealer and put them in the some storage conditions as 6-2-2. then they should be used within 2 weeks. (3) please make a soldering after a follewing baking treatment if unused term should be over the conditions of (2) *recommendable conditions: 0 in taping temprature:6o?c to 6y?c,time:j6 to 38 hours 0 in individual (on pwb or metallic tray) tempnture: ioo?c to 13oc .time:z to 3 hours
6-3. label _ i lot no.ka99b19 rank o-0 we in japan + model number - qmtity of products +-eiktg3barcode + el4j c-3 bar code + lot number l and luminous rank, dominant wavelength rank + reduction country @ prodwtion plant code@0 be indicated alphabetically) @ roduetion lot(single or double figures) @ year of production(tbe last two figures of the year) . @ month of production (to be indicated alphabetically with january corresponding to a) @ date of production(0 l-3 1) 1 6-4.luninous intensity rank(note 1) (yeiiow-green) (ta=25?c) . luminous intensity unit condition b 173 - 33.8 c 25.0 - 48.8 mcd i&!oma d 36.0 - (70.2) (tolerance : + 15%) cre4 (ta=25?c) dominant wavelength unit condition . a 6.0 - 11.8 b 8.8 - 17.0 c 12.7 - 24.6 ml ipzoma d 18.3 - (35.5) (tolerance: f 15%) (note 1) also i shail not ask the delivery ratio of each rank. (note 2) this rank value is the setting value of when that classifies it the rank and be not a guarantee value.
- 992004 1 dedy99 dg : .-- model no. page -- -my i .,--. ;-.. -ltiedsoa l2/13 z-*, a_ i _ j j ,-.> i?- *> *- .7; . --.-. -?q ,y * ----__c:. . .,-> ?2x4 : - -.- -. .___ 7. soldering 7; 1 .reflow soldering (1) it is not recommended to exceed the soldering temperature and time shown below. caused by substrate bend or the other mechanical stress during reflow soldering may happen gold wire disconnection etc. therefore please check and study your solder reflow machine?s best condition. (2) reflow soldering temperature profile to be done under the following condition. 140-160 g time(s) recommendable thermal model (3) recommendable metal ~mask pattern for screen print recommend 0.3m.m to 0.5~1 thickness metal mask for screen print caused by solder reflow $ondition, solder paste, substrate and the other material etc., may change solderbility. please check and study actual solderbility before usage. *center of the moduct 1 1.2 1 llo/ r- -r- 1.24 - recommended soldar pattern (unir:mxn)
i--.._ _ dg- 992004 1 dee/3/99 i ?.--.? i j.= j ,v+??-- i 4 y= i-,j t;tledgoi i l l:i ~ - . . _. : . 8. recautions for use 8- 1. &cautions matters for designing circuit this product is not designed as electromagnetic and ionized-particle radiation resistant 8-2. cleaning method use only the following types of solvent.%ater? recommend conditions: rt. 4okhz, 3ow/l, time is more than 3 minutes the alkt on the device f?om ultrasonic bath, ultrasonic output, duration, board size and device mounting method. test the cleaning method under actual conditions and check for abnormalities before actual use. 9. environment 9- 1. ozonosphere destructive chemicals. (1) the device doesn?t contain following substance. (2) the device doesn?t have a production line whose process requires following substance. restricted part: cfcs,halones,cc~,trichloroetbane(methychloroform) 9-2. bromic non-bum& materials i the device doesn?t contain bromic non-burning materials(pbbos,pbbs) .
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